Powerbackplane 3 U variant R0/L0 DIN 41612 type M

The backplanes have been designed according to the PICMG 2.0 power supply unit connector pin assignment specification and the ATX power supply specification.

The backplanes are intended for mounting in a 19” card rack with 3 U in which

• variant R0 has the pin A1 of the connector to DIN 41612 type M on bottom side.
• variant L0 has the pin A1 of the connector to DIN 41612 type M on top side.

This means that power supply units designed according to this specification can be used in any card rack position without leaving any gaps.

The backplanes can be installed directly on the card rack mounting channel.

Their installation width is 8 HP. Contiguous backplane placement in the 8 HP slot spacing is possible.

Power supply X1

AC or DC Power is supplied to the power supply unit via the connector to DIN 41612 type M X1 by the below assigned Pins. They are realized with fitting in crimp- or solder-sockedcontacts.

The IMS 346.24.2315.401 (crimpversion) or the IMS 093.24.2115.401 (solder-version) can be used as socked-contacts for the connector to DIN 41612 type M.
Variant L0: Any additional connections desired, e. g. CGND to CHA-GND (X8), may be established using appropriate wiring.

Caution:
Once input power is connected, hazardous voltages may be present on the backplane.

Please observe the applicable national and international standards for handling hazardous voltages when connecting such voltages to the backplane.

Power supply connections

The main operating voltages of +5 V, +3.3 V and the +12 V, –12 V auxiliary voltages are connected via M4 screwtype terminals and cable lugs.

GND is connected via two M4 screwtype terminals arranged with a spacing of

• variant R0: 20.32 mm (.8”)
• variant L0: 10.16 mm (.4”)

Either a cable lug or a terminal bar can be mounted on these connections.

Jumpers

Jumper J1 connects the EN- signal (X1-C13), which is connected to PSON (X12-14), to GND. This permits the power supply unit to be started up automatically. If this is not desirable, jumper J1 is to be removed, and the power supply unit is to be started using external wiring.

Jumper J2

• variant R0: The FAL- signal of X1 can be connected to FAL- of X10 via jumper J2.
• variant L0: The FAL- signal of X1 can be connected to FAL- of X10 and X13 via jumper J2.

Pin C14 of X1 (signal DEG-) is connected to pin 8 of X12 via jumper J3.

Test points

Since INH‑ is not used, pin A14 of X1 is only connected to test point T1.
Since +5 V STDBY of X1 is not used, pin 9 of X12 is only connected to test point T3.
Since –5 V of X1 is not used, pin 18 of X12 is only connected to test point T4.

Frame Ground Connection X8

(only variant L0)
There is a solid electrically conductive frame GND surface in the bus boardto-card rack mounting area. An M4 screw-type terminal is used to connect the frame ground.

In smaller systems, this connection can be chosen as a star point for frame ground. Pin B11 of X1 is then also connected to the frame GND surface.
In larger systems, a suitable star point position must be located for the frame ground connection.

A capacitor (C1) next to the mounting holes in each slot is standard equipment. These capacitors provide HF-coupling of CHA-GND with LOGIC-GND. A 1 MΩ resistor discharges the capacitors and electrostatic currents. This guarantees EMC-tight mounting of the bus board on the card rack.

Since PRST- does not exist on connector X1, PRST- has only been run to test point T2 on X10 and X13 (variant L0). Further wiring can be implemented from there.

Pin Assignments X1 (Connector DIN 41612 type M)

Pin Assignments

Mating connector and pins (e. g.)