Technical data
| Base material | Fiberglass epoxide acc. to DIN 40802 (type FR4), flame-retardant according to UL 94 V-0 |
| Layer structure | Optimized for best HF behavior. |
| Ohmic resistance of signal lines |
< 2 Ω |
| PCB thickness | 3.4 mm |
| Impedance Z of bare PCB | 65 Ω |
| Power supply connection | Screw-type terminals M3, M4 and ATX connector |
| Permissible current loading of backplane per slot (at 20 °C) |
5 V 8 A/slot 3.3 V 10 A/slot ±12 V 2 A/slot V (I /O) 4 A/slot |
| Installation height | 6 U |
| Slot spacing | 4 HP |
| V (I/O) | 3.3 V/5 V, fixed setting |
| Clock frequency | 33/66 MHz (≤ 5 slots) |
| Transfer mode | 32 bit /64 bit |
| Hot swap | acc. to PICMG 2.1 R1.0 |
| Connectors | 2 mm press-fit connectors, quality grade 2 |
| Termination (8 slot backplane only) |
On-board Schottky barrier diodes |
| Operating temperature range | –40 °C … +85 °C |
| Relative humidity | 90 %, non-condensing |