Technical data
| Base material | Fiberglass epoxide acc. to DIN 40802 (type FR4) |
| PCB design | Optimized for best HF behavior |
| Card thickness | 2.8 mm (3 U)/3.4 mm (6 U) |
| Installation height | 3 U/6 U |
| Impedance Z of bare PCB | 65 Ω |
| Ohmic resistance of signal lines | < 1.5 Ω |
| Permissible current loading of backplane | 5 V up to 8 A per slot 3.3 V up to 10 A per slot |
| Power supply connection type |
depending on variant: Screw-type terminals, blade connectors, ATX connectors, socket connectors to DIN 41612 type M, P47 power connector |
| Supply voltage V (I/O) | 3.3 V/5 V, fixed setting or selection via jumper |
| Clock frequency | 33/66 MHz (≤ 5 slots) |
| Transfer mode | 32 bit/64 bit |
| Termination, 8 slots | On-board Schottky barrier diodes |
| Plug-in connectors | 2 mm press-fit connectors, quality grade 2 |
| Hot swap | acc. to PICMG 2.1 R1.0 |
| Operating temperature range | < 8 slots: –40 °C … +85 °C ≥ 8 slots: 0 °C … +70 °C |
| Relative humidity | 90 %, non-condensing |